Power Semiconductors Assembly
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Power Semiconductors Assembly
Single-phase full-control bridge B2C series, single-phase half-control bridge B2Hx series, single-phase rectification bridge B2U series
Cooling method | Device type |
Type -Id-VVN |
Rated output current ld(A) |
Outline | Cooling condition |
Device voltage (V) |
||
Air cooling | Modules | B2x-xxx-xxxFA | 40~160 | Fig.1a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 | ||
B2x-xxx-xxxFB | 180~200 | Fig.1b | ||||||
B2x-xxx-xxxFC | 250~400 | Fig.3 | ||||||
Capsule devices |
B2x-xxx-xxxFD | 300~800 | Fig.9b | |||||
B2x-xxx-xxxFE | 800~1200 | Fig.10b | ||||||
B2x-xxx-xxxFF | 1200~2000 | Fig.13b | ||||||
Water cooling | Capsule devices |
B2x-xxx-xxxSA(B/C/D/E) | 100~2500 | Fig.15-19 | Flow≥4L/min Intake Water temperature≤40℃ |
Three-phase rectification bridge B6U series, three-phase full-control bridge B6C series, three-phase half-control bridge B6HK series.
Cooling method | Device type |
Type -Id-VVN |
Rated output current Id(A) |
Outline | Cooling condition |
Device voltage (V) |
|
Air cooling | Modules | B6x-xxx-xxxFA | 80~200 | Fig.1a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 | |
B6x-xxx-xxxFB | 200~300 | Fig.1b | |||||
B6x-xxx-xxxFC | 300~500 | Fig.3 | |||||
Capsule | B6x-xxx-xxxFD | 400~1600 | Fig.9a | ||||
B6x-xxx-xxXFE | 1000~2000 | Fig.10a | |||||
B6x-xxx-xxxFF | 1500~3000 | Fig.13a | |||||
Water cooling | Capsule | B6x-xxx-xxxSA(B/C/D/E) | 300~4000 | Fig.15-19 | Flow≥4L/min Intake Water temperature≤ 40℃ |
Six phase bridge
Cooling method | Device type |
Type -Id-VVN |
Rated output current ld(A) | Outline | Cooling condition |
Devicevoltage (V) |
|
double-star type with balance reactor |
double-star type without balance reactor |
||||||
Air cooling | Modules | M6x-xxx-xxxFA | 150~350 | 130~300 | *Fig.1a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 |
M6x-xxx-xxxFB | 450~600 | 350~500 | *Fig.1b | ||||
M6x-xxx-xxxFC | 800~1200 | 600~800 | *Fig.3 | ||||
Capsule devices |
M6x-xxx-XxxFD | 1500~2500 | 1200~2000 | Fig.9a | |||
M6x-xxx-xxxFE | 3000~4000 | 2500~3400 | Fig.10a | ||||
M6x-xxx-xxxFF | 5000~6000 | 4000~5000 | Fig.13a | ||||
M6x-xxx-xxxFG | 1500~1800 | 1000~1500 | Fig.14 | ||||
Water cooling | Capsule devices |
*M6x-xxx-xxxSA (B/C/D/E) |
500~8000 | 400~5000 | *Fig.15-19 | Flow≥4L/min Intake Water temperature≤40℃ |
Single phase AC switch
Cooling method | Devicetype | Type -IRMS-VNN |
Rated output current IRMS(A) |
Outline | Cooling condition |
Device voltage (V) |
|
Air cooling | Modules | W1C-xxx-xxxFA | 90~150 | Fig.2a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 | |
W1C-xxx-xxxFB | 200~250 | Fig.2b | |||||
W1C-xxx-xxxFC | 300 | Fig.4 | |||||
Capsule devices | W1C-xxx-xxxFD | 400~800 | Fig.5 | ||||
W1C-xxx-xxxFE | 1000~1200 | Fig.6 | |||||
W1C-xxx-xxxFF | 1500~1800 | Fig.11 | |||||
Water cooling | Capsule devices |
W1C-xxx-xxxSA(B/C/D/E) | 600~2500 | Fig.15-19 | Flow≥4L/min Intake Water temperature≤40℃ |
||
W1C-xxx-xxxSI(J/K) | 800~1200 | Fig.20~22 |
Thee phase AC switch
Cooling method | Device type |
Type -IRMS-VVN |
Rated output current IRMS(A) |
Outline | Cooling condition |
Device voltage (V) |
|
Air cooling | Modules | W3C-xxx-xxxFA | 90~150 | Fig.2a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 | |
W3C-xxx-xxxFB | 200~250 | Fig.2b | |||||
W3C-xxx-xxxFC | 300 | Fig.4 | |||||
Capsule devices | W3C-xxx-xxxFD | 400~800 | Fig.7 | ||||
W3C-xxx-xxxFE | 1000~1200 | Fig.8 | |||||
W3C-xxx-xxxFF | 1500~1800 | Fig.12 |
Six phase AC switches
Cooling method | Device type |
Type -Id-VNN |
Rated output current Id(A) |
Outline | Cooling condition |
Device voltage (V) |
Air cooling |
Modules | (B6C)2x-xxx-xxxFA | 80~150 | *Fig.26a | Wind speed ≥6m/s Ambient temperature ≤40℃ |
100~2000 |
(B6C)2x-xxx-xxxFB | 200~260 | *Fig.26b | ||||
Capsule devices |
(B6C)2x-xxx-xxxFE | 800~1200 | Fig.24 | |||
(B6C)2x-xxx-xxxFF | 1500~2000 | Fig.25 |
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