FS100R12KT3
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FS100R12KT3
The FS100R12KT3 is a high-power IGBT (Insulated Gate Bipolar Transistor) module. It features a six-pack configuration (three-phase inverter bridge with integrated freewheeling diodes) using fast trench/fieldstop IGBT3 technology paired with emitter-controlled high-efficiency diodes. This design emphasizes low switching and conduction losses, making it suitable for efficient power conversion in industrial inverters. The module includes an integrated NTC thermistor for temperature sensing and is rated for 1200 V blocking voltage with up to 140 A collector current.
Applications
Three-phase inverters for motor drives (e.g., industrial pumps, fans, servo systems).
Renewable energy systems like solar and wind inverters.
Uninterruptible power supplies (UPS) and welding equipment.
General power conversion in automation and robotics requiring high reliability and efficiency.
Key Features
Switching Technology: Fast trench/fieldstop IGBT3 for reduced switching losses and improved efficiency; emitter-controlled diodes for soft recovery and low reverse recovery charge.
Thermal Design: Copper baseplate for superior heat dissipation; low thermal resistance (R_thJC = 0.26 K/W per IGBT); Al₂O₃ substrate with internal isolation (2.5 kV RMS).
Mechanical Specs: Compact housing (122 mm x 62 mm x 31 mm, 300 g); low stray inductance (21 nH); solderable pins for low-inductance connections; RoHS compliant.
Reliability: Positive temperature coefficient for easy paralleling; creepage distance 10 mm; CTI > 225; mounting torque 3–6 Nm for M5 screws.
Operational Limits: Junction temperature up to 125°C (under switching); storage -40°C to 125°C; gate voltage ±20 V max.
Parameter | Symbol | Value (IGBT) | Value (Diode) | Notes |
---|---|---|---|---|
Collector-Emitter Voltage / Repetitive Reverse Voltage | V_CES / V_RRM | 1200 V | 1200 V | T_vj = 25°C |
Nominal DC Current | I_C / I_F | 100 A (T_C=80°C); 140 A (T_C=25°C) | 100 A | T_vj max = 150°C |
Repetitive Peak Current | I_CRM / I_FRM | 200 A | 200 A | t_p = 1 ms |
Saturation/Forward Voltage | V_CE,sat / V_F | 1.70 V (25°C); 2.15 V (125°C) | 1.65 V (25°C); 2.15 V (125°C) | I_C/I_F = 100 A, V_GE = 15/0 V |
Gate Threshold Voltage | V_GE,th | 5.0–6.5 V | - | I_C = 4 mA, V_CE = V_GE |
Total Gate Charge | Q_G | 0.90 μC | - | V_GE = ±15 V |
Input Capacitance | C_ies | 7.10 nF | - | f=1 MHz, V_CE=25 V |
Reverse Transfer Capacitance | C_res | 0.30 nF | - | f=1 MHz, V_CE=25 V |
Turn-On Delay Time | t_d,on | 0.26 μs (25°C); 0.29 μs (125°C) | - | Inductive load, V_CC=600 V, R_G=3.9 Ω |
Turn-Off Delay Time | t_d,off | 0.42 μs (25°C); 0.52 μs (125°C) | - | Inductive load, V_CC=600 V, R_G=3.9 Ω |
Turn-On Energy | E_on | 10.0 mJ | - | V_CC=600 V, L_S=70 nH |
Turn-Off Energy | E_off | 10.0 mJ | - | V_CC=600 V, L_S=70 nH |
Short-Circuit Current | I_SC | 400 A | - | t_p ≤ 10 μs, V_CC=900 V, T_vj=125°C |
Peak Reverse Recovery Current | - | - | 120 A (25°C); 140 A (125°C) | -di_F/dt=2600 A/μs, V_R=600 V |
Recovered Charge | Q_r | - | 10.0 μC (25°C); 20.0 μC (125°C) | -di_F/dt=2600 A/μs, V_R=600 V |
Thermal Resistance (Junction-to-Case) | R_thJC | 0.26 K/W | 0.48 K/W | Per device |
Thermal Resistance (Case-to-Heatsink) | R_thCH | 0.09 K/W | 0.14 K/W | Per device, λ=1 W/(m·K) |
Total Power Dissipation | P_tot | 480 W | - | T_C=25°C, per module |
NTC Resistance at 25°C | R_NTC | 4.7 kΩ | - | Integrated thermistor, β=3950 K |
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